15 – 16 aprile 2025, BolognaFiere

Ilfa

Profilo aziendale

ILFA is a German PCB manufacturer headquartered in Hanover. The owner-managed company with around 190 employees has been producing innovative ultra-fine and micro-fine conductor solutions in the high-tech segment for over 40 years. With a logistics location in Kirchheimbolanden near Frankfurt a.M. and its own office in Shenzhen, China, both national and international customers are served. Consistent material qualities can thus be guaranteed throughout the world.

ILFA’s range of services includes CAD services for the creation of the design of prototypes, small series through to the further development of large series. Both single and double-sided PCBs are manufactured, as well as multilayers with more than 30 layers. Depending on the application, the board is designed as a classic rigid, flexible or rigid-flexible PCB. This also applies to the high layer area. ILFA has numerous certifications, realises complex hybrid structures and has the manufacturing competence of electro-optical PCBs, the embedding of components or the integration of fluid channels.

ILFA’s success is based on the first-class quality of its products and their continuous development at the highest level. Partners and customers are used to driving ideas and innovations forward with ILFA and being able to rely on the company and its competent contacts at all times. With its own laboratories, measurement and test procedures as well as a team of outstanding developers, ILFA is prepared for all requirements. Customers can thus drive their innovations forward and realise economically promising solutions.

ILFA’s customers include national and international research institutes, companies from the fields of aerospace, industrial electronics, medical technology, the automotive industry and, in particular, innovators from the robotics, sensor technology and satellite technology segments. Of course, creative small businesses also find a home at ILFA to optimize their PCB layouts and develop prototypes for tomorrow’s applications.